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■ Qualified for Automotive Applications
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■ Output Voltage 5 V ± 2%
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■ Very Low Current Consumption
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■ Power-On and Undervoltage Reset
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■ Reset Low-Level Output Voltage < 1 V
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■ Very Low Dropout Voltage
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■ Short-Circuit Proof
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■ Reverse-Polarity Proof
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CATALOG |
TLE4275QKVURQ1 COUNTRY OF ORIGIN |
TLE4275QKVURQ1 PARAMETRIC INFO
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TLE4275QKVURQ1 PACKAGE INFO
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TLE4275QKVURQ1 MANUFACTURING INFO
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TLE4275QKVURQ1 PACKAGING INFO
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TLE4275QKVURQ1 ECAD MODELS
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TLE4275QKVURQ1 APPLICATIONS
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COUNTRY OF ORIGIN
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China |
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PARAMETRIC INFO
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Type |
LDO |
Number of Outputs |
1 |
Maximum Output Current (A) |
0.45 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Output Type |
Fixed |
Output Voltage Range (V) |
1.8 to 10 |
Junction to Ambient |
40.3°C/W |
Junction to Case |
31.8°C/W |
Polarity |
Positive |
Special Features |
Current Limit|Reverse Polarity Protection|Short Circuit Protection|Thermal Protection |
Load Regulation |
30mV |
Line Regulation |
15mV |
Maximum Dropout Voltage @ Current (V) |
0.5@300mA |
Minimum Input Voltage (V) |
5.5 |
Maximum Input Voltage (V) |
42 |
Output Voltage (V) |
5 |
Typical Quiescent Current (mA) |
5 |
Typical Dropout Voltage @ Current (V) |
0.25@300mA |
Accuracy (%) |
±2 |
Supplier Temperature Grade |
Automotive |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Typical PSRR (dB) |
27 |
Typical Output Capacitance (uF) |
10(Min) |
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PACKAGE INFO
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Supplier Package |
TO-252 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
5 |
Lead Shape |
Gull-wing |
PCB |
4 |
Tab |
Tab |
Pin Pitch (mm) |
1.14 |
Package Length (mm) |
6.7(Max) |
Package Width (mm) |
6.22(Max) |
Package Height (mm) |
2.39(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
6.7(Max) |
Package Overall Width (mm) |
10.41(Max) |
Package Overall Height (mm) |
2.52(Max) |
Seated Plane Height (mm) |
2.52(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Deca Watt Package |
Package Family Name |
TO-252 |
Jedec |
TO-252AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
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ECAD MODELS
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APPLICATIONS
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• Qualified for Automotive Applications
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• Cluster
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• Body Control Modules
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• Heating Ventilation and Air Conditioning (HVAC) |
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