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• Trimmed Oscillator for Precise Frequency Control |
• Oscillator Frequency Guaranteed at 250 kHz |
• Current Mode Operation to 500 kHz |
• Automatic Feed Forward Compensation |
• Latching PWM for Cycle−By−Cycle Current Limiting |
• Internally Trimmed Reference with Undervoltage Lockout |
• High Current Totem Pole Output |
• Undervoltage Lockout with Hysteresis |
• Low Startup and Operating Current |
• This is a Pb−Free and Halide−Free Device |
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CATALOG |
UC3843BVD1R2G COUNTRY OF ORIGIN |
UC3843BVD1R2G PARAMETRIC INFO |
UC3843BVD1R2G PACKAGE INFO |
UC3843BVD1R2G MANUFACTURING INFO |
UC3843BVD1R2G PACKAGING INFO |
UC3843BVD1R2G ECAD MODELS |
UC3843BVD1R2G FUNCTIONAL BLOCK DIAGRAM
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COUNTRY OF ORIGIN |
Philippines |
Thailand |
Indonesia |
China |
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PARAMETRIC INFO |
Control Method |
Current |
Topology |
Boost|Flyback |
Number of PWM Outputs |
1 |
Maximum Duty Cycle (%) |
96(Typ) |
Switching Frequency (kHz) |
500 |
Output Current (mA) |
1000(Max) |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
105 |
Rise Time (ns) |
50 |
On/Off Pin |
No |
Adjustable Output |
No |
Synchronous Pin |
No |
Fall Time (ns) |
50 |
Operating Supply Voltage (V) |
30(Max) |
Maximum Supply Current (mA) |
12(Typ) |
Maximum Operating Supply Voltage (V) |
30 |
Maximum Power Dissipation (mW) |
702 |
Oscillator Accuracy (kHz) |
250 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Type |
Current Mode PWM Controller |
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PACKAGE INFO |
Supplier Package |
SOIC N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
5 to 6 |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/A |
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PACKAGING INFO |
Packaging Suffix |
R2 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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